Portalis

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The Portalis project presented many engineering and design challenges. The foremost was design density, heat dissipation, functionality and ergonomics. The extremely high design density included packaging 8 working processor modules into one 3U rack chassis. And include an interface board, power supply, cooling fans, and mounting hardware plus all 8 processor boards need to be "Hot Swapable", modular, and EMI compliant.
Cooling was the major concern and most of the design considerations revolved around this issue. Because of the very high electronic frequencies of the internal components, the cooling requirement worked directly against the EMI shielding design criteria. Ultimately, our physical prototype demonstrated that the modular cartridge design worked just as intended and the airflow solution meet all our EMI and cooling concerns.

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